Amplitude Method to Detect Debonding for Stack Bond Adhesive

dc.contributor.advisor	Barber, Gary
dc.contributor.author	Huang, Xiabao
dc.contributor.other	Gu, Randy
dc.contributor.other	Wang, Xia
dc.contributor.other	Latcha, Michael
dc.contributor.other	Qu, Hongwei
dc.contributor.other	Zhou, Jun
dc.date.accessioned	2024-10-02T13:33:44Z
dc.date.available	2024-10-02T13:33:44Z
dc.date.issued	2024-01-01
dc.description.abstract	Adhesively bonded joints have been applied in the automotive industry for the past few decades due to their advantages such as higher fatigue resistance, light weight, capability of joining dissimilar materials, good energy absorption and high torsional stiffness for overall body structure. They also provide an effective seal against noise and vibration at a low cost. There exists the challenge of defining the fatigue characteristics of adhesive joints under cyclic loading conditions and conventional methods have limitations in detecting the crack initiation of a bonded joint. This study introduces a method of detecting crack initiation by using the frequency method. It is found that stiffness change in the system is highly correlated to change in natural frequencies. By monitoring the change in natural frequencies, the crack initiation can be detected.
dc.identifier.uri	https://hdl.handle.net/10323/18262
dc.relation.department	Mechanical Engineering
dc.subject	Adhesive
dc.subject	Amplitude
dc.subject	Bonding
dc.subject	Crack initiation
dc.subject	Crack propagation
dc.subject	Vibration
dc.title	Amplitude Method to Detect Debonding for Stack Bond Adhesive

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